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主题： PCB电路板工厂内部术语 [] |
 发表于 2007/10/16 14:10:00
Process Module 说明: A. 下料( Cut Lamination) a-1 裁板( Sheets Cutting) a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling) b-1 内钻(Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔(2nd Drilling) b-4 雷射钻孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 干膜制程( Photo Process(D/F)) c-1 前处理(Pretreatment) c-2 压膜(Dry Film Lamination) c-3 曝光(Exposure) c-4 显影(Developing) c-5 蚀铜(Etching) c-6 去膜(Stripping) c-7 初检( Touch-up) c-8 化学前处理,化学研磨( Chemical Milling ) c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing ) c-11 去膜(Stripping ) D. 压合Lamination d-1 黑化(Black Oxide Treatment) d-2 微蚀(Microetching) Developing , Etching & Stripping ( DES ) d-3 铆钉组合(eyelet ) d-4 叠板(Lay up) d-5 压合(Lamination) d-6 后处理(Post Treatment) d-7 黑氧化( Black Oxide Removal ) d-8 铣靶(spot face) d-9 去溢胶(resin flush removal) E. 减铜(Copper Reduction) e-1 薄化铜(Copper Reduction) F. 电镀(Horizontal Electrolytic Plating) f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating) f-3 低于1 mil ( Less than 1 mil Thickness ) f-4 高于1 mil ( More than 1 mil Thickness) f-5 砂带研磨(Belt Sanding) f-6 剥锡铅( Tin-Lead Stripping) f-7 微切片( Microsection) G. 塞孔(Plug Hole) g-1 印刷( Ink Print ) g-2 预烤(Precure) g-3 表面刷磨(Scrub) g-4 后烘烤(Postcure) H. 防焊(绿漆): (Solder Mask) h-1 C面印刷(Printing Top Side) h-2 S面印刷(Printing Bottom Side) h-3 静电喷涂(Spray Coating) h-4 前处理(Pretreatment) h-5 预烤(Precure) h-6 曝光(Exposure) h-7 显影(Develop) h-8 后烘烤(Postcure) h-9 UV烘烤(UV Cure) h-10 文字印刷( Printing of Legend ) h-11 喷砂( Pumice)(Wet Blasting) h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Gold plating i-1 金手指镀镍金( Gold Finger ) i-2 电镀软金(Soft Ni/Au Plating) i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling) j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡( Vertical Hot Air Solder Leveling) j-3 超级焊锡(Super Solder ) j-4. 印焊锡突点(Solder Bump) K. 成型(Profile)(Form) k-1 捞型(N/C Routing ) (Milling) k-2 模具冲(Punch) k-3 板面清洗烘烤(Cleaning & Backing) k-4 V型槽( V-Cut)(V-Scoring) k-5 金手指斜边( Beveling of G/F) L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection) l-2 VRS 目检(Verified & Repaired) l-3 泛用型治具测试(Universal Tester) l-4 专用治具测试(Dedicated Tester) l-5 飞针测试(Flying Probe) M. 终检( Final Visual Inspection) m-1 压板翘( Warpage Remove) m-2 X-OUT 印刷(X-Out Marking) m-3 包装及出货(Packing & shipping) m-4 目检( Visual Inspection) m-5 清洗及烘烤( Final Clean & Baking) m-6 护铜剂(ENTEK Cu-106A)(OSP) m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing) m-9 焊锡性试验( Solderability Testing ) N. 雷射钻孔(Laser Ablation) N-1 雷射钻Tooling孔(Laser ablation Tooling Hole) N-2 雷射曝光对位孔(Laser Ablation Registration Hole) N-3 雷射Mask制作(Laser Mask) N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除胶渣(Desmear) N-8 微蚀(Microetching ) A/W (artwork) 底片 Ablation 烧溶(laser),切除 abrade 粗化 abrasion resistance 耐磨性 absorption 吸收 ACC ( accept ) 允收 accelerated corrosion test 加速腐蚀 accelerated test 加速试验 acceleration 速化反应 accelerator 加速剂 acceptable 允收 activator 活化液 active work in process 实际在制品 adhesion 附着力 adhesive method 黏着法 air inclusion 气泡 air knife 风刀 amorphous change 不定形的改变 amount 总量 amylnitrite 硝基戊烷 analyzer 分析仪 anneal 回火 annular ring 环状垫圈;孔环 anode slime (sludge) 阳极泥 anodizing 阳极处理 AOI ( automatic optical inspection ) 自动光学检测 applicable documents 引用之文件 AQL sampling 允收水准抽样 aqueous photoresist 液态光阻
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